AMD Unveils More Ryzen 3D Packaging and V-Cache Details …
WEBAug 23, 2021 · While AMD's new interconnect comes with a 9-micrometer (μm) pitch (distance between TSV), standard C4 packaging has a 130 μm pitch, and Microbump 3D comes with a 50 μm pitch.
Packaging Tips and Shipping Suggestions for AMD Warranty …
WEBThis article provides tips and guidelines for packing and shipping your AMD product for RMA warranty service. The contents of this article are organized into the following sections: Packing Tips. Product Packing Instructions.
Advanced Packaging: Enabling Moore’s Law’s next fr... - AMD …
WEBJan 6, 2022 · AMD’s move to chiplet-based architectures drives its CPU/GPU roadmaps and relies heavily on next-generation die-to-die interconnect schema, enabled by new advanced packaging technologies. Many package architectures exist to enable die-to-die interconnects across various product segments.
AMD 3D V-Cache™ Technology
WEBAMD continues to be the leader in advanced packaging technology with AMD 3D V-Cache™ technology. AMD is enabling a 3D vertical cache to create the world’s fastest gaming desktop processor when it was launched 3 – the AMD Ryzen 7 5800X3D – and today, the world’s new fastest gaming processor …
What is AMD 3D V-Cache? Ryzen packaging tech, explained - Digital Trends
WEBApr 5, 2023 · AMD 3D V-Cache is a packaging technology that stacks additional layers of cache on top of a CPU. It sounds complex, and from an engineering perspective, it is, but it’s not hard to...
AMD Discusses ‘X3D’ Die Stacking and Packaging for ... - AnandTech
WEBMar 5, 2020 · The new packaging technology was listed as ‘future’, with no confirmed date. With AMD today announcing its new CDNA architecture for programmable compute graphics solutions, that sort of...
AMD details its 3D packaging technology at Hot Chips 33
WEBAug 23, 2021 · AMD highlighted that their existing 3D packaging technology enables die-on-die stacking, allowing AMD to stack additional L3 cache on their Ryzen 5000 series processors. This allows AMD to add 64MB of L3 cache to their Ryzen 5000 series compute chiplets, tripling its available L3 cache.
AMD Puts Hopes on Packaging, Memory on Logic, Optical …
WEBFeb 22, 2023 · AMD Puts Hopes on Packaging, Memory on Logic, Optical Comms for Decade Ahead. Advanced architecture and packaging will make up for tapering process technology benefits. When you purchase...
AMD Showcases Industry-Leading Innovation Across the High …
WEBJun 1, 2021 · AMD continues to build on its leadership IP and investments in leading manufacturing and packaging technologies with AMD 3D chiplet technology, a packaging breakthrough that combines AMD’s innovative chiplet architecture with 3D stacking using an industry-leading hybrid bond approach that provides over …
Advanced packaging, software bolster AMD's 30x25 goal
WEBDec 8, 2023 · The company launched the 30x25 initiative in 2021 with the goal to deliver a 30-fold improvement in compute efficiency from a 2020 baseline by 2025. And while these efforts present obvious advantages for the sustainability of computing, AMD's push to bolster the performance per watt of its chips is really a matter of survival.
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